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PRODUCTS
YES manufactures precision thermal, deposition, and wet process equipment for
innovative leaders in the life sciences, emerging technologies, and advanced semiconductor packaging.
Start your journey to breakthrough technologies with shorter process times, higher yields, improved
reliability, and lower total cost of ownership.
Clean SystemsChoose from three series of YES Clean Systems for gentle
surface cleaning, decontamination, and surface activation. YES Clean Systems can also descum and strip
off photoresist using downstream plasma. Unique benefits of YES Clean Systems include:
- Reduction in equipment footprint by half over competition
- Lower cost of ownership by almost 50%
- Proven high reliability from system designs with as few as three moving parts
Applications
- Plasma Cleaning
- Photoresist removal/descum
- Polyimide, organics and CuO removal
- Surface activation
- Adhesion promotion
- Plasma surface decontamination
RFS Series
EcoClean
G Series
RFS Series
User-friendly plasma cleaning systems provide higher yields and repeatable results.
- Removes thick layers of photoresist or polyimide quickly (up to 6,000-7,000 Å/min)
- Applications range from aggressive strip processes to gentle descum and surface modification
- Downstream process balances plasma charge and protects against damaging UV exposure
- Precise temperature control for uniform, repeatable results Up to four (4) process gas connections
- Up to four (4) process gas connections
User-friendly plasma cleaning systems provide higher yields and repeatable results.
- Removes thick layers of photoresist or polyimide quickly (up to 6,000-7,000 Å/min)
- Applications range from aggressive strip processes to gentle descum and surface modification
- Downstream process balances plasma charge and protects against damaging UV exposure
- Precise temperature control for uniform, repeatable results Up to four (4) process gas connections
Coat SystemsModify surfaces at the nanoscale with YES Coat Systems, which
apply monolayer coatings to induce hydrophobic (water-repelling) or hydrophilic (water-attracting)
properties. With YES Coat Systems, coat a variety of substrates with unique benefits including:
- Choose among 100+ chemical precursors
- Achieve up to 3X improvement in temperature uniformity over our competition
- Leverage YES expertise and proven history in deploying thousands of systems across various emerging industries
Applications
- Surface modification
(adhesion / hydrophobic / hydrophilic) - Adhesion improvement
- Anti-stiction layer
- Surface priming for microarrays
- DNA sequencing and microfluidics
- Self-assembled monolayer deposition
and removal - Seed layer for metallization
EcoCoat
UltraCoat™
TA Series
EcoCoat
Flexible Silane Monolayer Deposition/Prime System with Plasma
- Excellent control of process parameters yielding very stable processes with minimal chemical usage
- Scalable to volume production
- >100 chemical processes developed from organosilanes, PEG and biotin functional compounds
- 40KHz or 13.56MHz plasma pre-cure
Flexible Silane Monolayer Deposition/Prime System with Plasma
- Excellent control of process parameters yielding very stable processes with minimal chemical usage
- Scalable to volume production
- >100 chemical processes developed from organosilanes, PEG and biotin functional compounds
- 40KHz or 13.56MHz plasma pre-coat
Cure
SystemsTransform materials using thermal and chemical processes via
YES Cure Systems for emerging technology and emerging research needs. For instance, semiconductor
manufacturers have used YES Cure Systems to cure polyimide precursors for advanced packaging. With YES
Cure Systems:
- Achieve up to 50% improvement in cure time
- Cut total cost of ownership (TCO) in half
- Improve the performance of products with less outgassing, greater film stability, and higher reliability
Applications
- Polyimide, BCB or PBO cure
- Wafer-to-wafer bonding anneal
- Vacuum anneal up to 400°C
- Pre-metal or pre-PVD bake and degas
PB Series
VertaCure XP
VertaCure PLP
PB Series
Manual Load High-Temperature Vacuum Cure Systems
- Faster process: 3.5 hours vs 8+ hours
- Laminar flow reduces/eliminates particles
- More complete cure (5x less outgassing)
- Less film stress and low wafer warpage
- 1.6x to 2x less power and N2 consumption
- Much lower capital cost, 2-3x lower CoO
Manual Load High-Temperature Vacuum Cure Systems
- Faster process: 3.5 hours vs 8+ hours
- Laminar flow reduces/eliminates particles
- More complete cure (5x less outgassing)
- Less film stress and low wafer warpage
- 1.6x to 2x less power and N2 consumption
- Much lower capital cost, 2-3x lower CoO
BondPerform low-temp direct bonding and high-temp vacuum annealing with a single production-proven system. Ensure consistent high reliability for demanding 3D stacking and heterogeneous integration applications in high bandwidth memory and other critical areas.
- Repeatable, controllable results in high volume manufacturing
- Complete bonding with excellent reliability
- Excellent particle performance
Applications
- 3D packaging
- CMOS image sensors under panel
- Polyimide bake
- Copper anneal
- Wafer-to-wafer bonding annea
- DtP and PtP bonding
VertaBond
VertaBond
Ensure complete, reliable and void-free wafer and panel bonding in less time with a reduced thermal budget. Achieve superior bond strength and particle performance with excellent temperature uniformity. Key benefits include:
- Void-free hybrid bonding in less time and at lower temperatures
- Vacuum anneal provides Cu-Cu bonding without voids, delamination or dishing
- Laminar flow reduces/eliminates particles
- Bonding strength increases 3-4.5x under vacuum at temperatures as low as 200°C or 300°C compared to atmospheric anneal
- Vacuum anneal enables 6 μm pitch with no voids or bubbles
- Less film stress and low wafer warpage
Perform low-temp direct bonding and high-temp vacuum annealing with a single production-proven system. Ensure consistent high reliability for demanding 3D stacking and heterogeneous integration applications in high bandwidth memory and other critical areas.
- Repeatable, controllable results in high volume manufacturing
- Complete bonding with excellent reliability
- Excellent particle performance
Cassettes, Software, and Parts
YES offers a complete portfolio of cassettes and software for YES Clean, Coat, and Cure systems. You may also order customized cassettes and additional replacement parts for YES systems.
Other Parts, Accessories, and Software
Contact us to order replacement door seals and optional parts for your YES equipment.
YES (Yield Engineering Systems, Inc.)